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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

    Buy cheap Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip from wholesalers
     
    Buy cheap Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip from wholesalers
    • Buy cheap Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip from wholesalers
    • Buy cheap Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip from wholesalers
    • Buy cheap Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip from wholesalers

    Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

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    Brand Name : YUSH
    Model Number : YSL-1000SD
    Certification : CE Mark
    Price : business negotiation
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability : 25 Set/Sets per Month
    Delivery Time : 3 days to 7 days
    • Product Details
    • Company Profile

    Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip

    Basic Description
    The dicing system, refers to install a slim blade for special cutting at the head of the spindle,cut off glass, ceramic, semiconductor chip, PCB, EMC wire frame and other materials with high accuracy by using spindle’s high-speed rotation driving the cutting blade.
    Operation procedures
    Wafer or Strip Tape mounting Dicing Cleaning UV seperation
    Description of Semi-auto dicing
    The semi-auto dicing system, refers to a dicing system that loader and unloader by hand and only the procedure is automated in the process of dicing. The system is not equipped with automatic cleaning, drying, etc.
    Main procedures
    Feeding by hand Position align Auto-cutting Unloading by hand
    1.Operator manually place the material being cut on work platform.

    2.The cutting position is automatically calibrated.

    3.Press the start button to automatically complete the dicing process of material.

    4.Operator take the material manually being cut from the work platform.


    Applications

    Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
    Ceramic substrate Silicon rubber Lead frame
    Silicon wafer PCB Glass
    Operating Requirements
    1.Please use the clean compressed air that its atmospheric pressure dew point is in the -10 ~ -20℃, and the residual oil is divided into 0.1ppm, the filtering accuracy is above 0.01um/99.5%.
    2.Please use the equipment in a room of temperature between 20 ~ 25 ℃, and its fluctuation range control at ±1℃.

    3.Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃).

    4.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

    5.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist.

    6.Please follow the product manual we provided for operation strictly.



    Semi-dicing system YSL-1000SD Features of products
    1.Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
    2.Can meet the high precision cutting maximum diameter of 300 mm materials.
    3.High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
    4.CCD automatic align.
    5.Real-time monitoring of the system's air pressure, water pressure, current and other values to avoid spindle damage.
    6.Cutting Spindle : 2.4 kw × 1set (Max: 60,000 rpm)
    7.Repeat positioning accuracy: 0.001mm
    8.Cutting speed: 0.05 ~ 400 mm/sec
    9.Standard matching blade: 2 Inch (Max: 3 Inch)
    Case Sharing

    System compositionprojectUnitSpecification
    Dimensions of processingmmΦ300
    Dimensions of working platformmmΦ350
    X-axisWorking strokemm340
    Cutting speedmm/sec0.05 ~ 400
    Resolutionmm0.0001
    Y-axisWorking strokemm310
    Resolutionmm0.0001
    Repeat positioning accuracymm0.001 / 310
    Z-axisWorking strokemm60 (2 Inch blade)
    Resolutionmm0.0001
    Θ-axisAngle of rotationDeg360
    SpindlePowerKW2.4
    SpeedRpm5000 ~ 60000
    Machine’s specificationsPower supplyV3P 220 (50 ~ 60 Hz)
    Machine powerKW4
    Power air pressureMPa0.5 ~ 0.6
    Air consumptionL/min200
    Cutting water consumptionL/min4
    Cooling water consumptionL/min1.5
    Physical dimensionmm1040×1080×1750
    Machine net weightKG850

    Other Discription
    Optional equipment
    1.Function of blade damage detection;
    2.Automatic setting function;
    3.Dicing visual function;
    4. Using dicing blade with 3 Inch.
    Ordinary 8 inch working platform can only put 2pcs material.
    SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs material each time.
    1.Reduce the loading times;
    2.Meet the larger size of the product;
    3.Promote more than 8% efficiency.
    Quality Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip for sale
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