Temperature Profile → Process Management
Completely and professionally Achieve Zero Defect of Soldering
This device mainly used in analyzing data and process index to help
decide whether the wave soldering is in a suitable condition for
manufacturing,therefore,greatly reduces the number of defects.
Reduce the quantity of temperature measurement board,taking place
of conventional temperature measurement board’s singal temperature
testing method,and provide different process index testing
methods,such as drip flake time,parallelism,depth/chain speed.
Wave Explorer technical parameter:
| Model | YSL-UP6E4+C | YSL-R6E4-DC | YSL-SDT4-ME |
| Frame size | W=160MM/235MM/260MM/360MM/460MM;(optional)L=380mm,H=35mm；The normal
width of the frame is 160mm and 235mm. |
| Recorder size(mm) | 152(L)*93(W)*17(H) | 142(L)*62(W)*15(H) |
| Test Result Reading Method | USB to PC, software analysis automatically. | LCD displays the result immediately.
/USB to PC, software analysis automatically. |
| Temperature Channel No | 6 EA |
| Tin Touching Channel No | 3 physical sensing channels |
| Speed Channel No | 1 EA |
| Accuracy | Temp:±0.8℃ Tin touching Time:±0.01S Speed:＜±1cm/min | Temp:±0.5℃ Tin touching Time:±0.01S Speed:＜±1cm/min |
| Resolution | Temp:±0.25℃ Tin touching Time:0.01S Speed:0.1cm/min | Temp:±0.1℃ Tin touching Time:0.01S Speed:0.1cm/min |
| Sample Frequency | 0.1-32S,Adjustable | 0.1-400S,Adjustable |
| Temperature Measuring Range | 0-300℃ |
| Thermocouple Type | K Type |
| Battery | Rechargeable battery |
| Stand-by Time | Super power saving design, standby for 30 days | Super power saving design, standby for 280 days |
| Data Interface | Mini USB2.0 | Mini USB |
| Software Environment | Microsoft Windows 2000/XP/WIN7/WIN8(32/64bit) |
| Software Language | English, simplified Chinese, traditional Chinese |
Wave Explorer:
1. Used in wave soldering temperature test and drip flake test.
2. Can be used to test acailable space of solder pot for solder
pin.
3. Maximum uniformity during preheating.
4. Preheating peak temperature uniformity.
5. Temperature uniformity before dipping tin.
6. A drop in temperature before dipping tin.
7. Tin temperature uniformity.
8. Tin dipping parellelism.
9. Drip flake time.
10. Drip flake depth.
11. Tin wave height can be adjusted accurately.
12. Test tin temperature accurately.
13. Chain speed.
BL-300 plug-in assembly line BF-350 Buffer conveyor
UB-350 PCB Exhaust Device(imporous belt) Auto filling with solder
tin and solder bar
Options For Wave Soldering System
Fluxer coating:1.Partial selective spraying
Flowmeter:1.Glass rotameter;2.Electronic digital display
flowmeter;3.Flux closed loop control;
Conveyor system:1.Electrical width adjustment.
Solder pot:1.Materials for solder container: a.Casting iron;
b.Titanium alloy;
2.Electric control solder pot movement.
Solder auto-feeding system Local Nitrogen safety device.
Double rail wave soldering(Back to Back)
MES interface
Barcode reader:1.Scan the bar code on the jig or PCB.
Cooling type:1.Water cooling chiller
Preheating system:4 sections of preheating can be customized,and
the length is 2.3m.
Note:Some options are mainly used for the configuration specified
types.Please make sure before ordering for manufacturer's
convenience.
Electronic digital display flowmeter Glass gauge flow meter
Water cooling chiller Four sections of preheating
