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500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

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500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

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Brand Name :	YUSHUNLI
Model Number :	YSF4/46
Certification :	CE ISO
Price :	USD1000~10000
Payment Terms :	L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :	80Sets/Month
Delivery Time :	10-15work days

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500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

500 X 460 (Mm) Pcb Size High Quality Selective Soldering Flux Spray Module/Reflow Oven

Specification:

MODEL

YSF4/46

YSS4/46

Equipment parameters	Dimension(L×W×H)	950 x 1776 x 1565 (mm)	1700 x 1776 x 1565 (mm)
Transport Parameters	Transport width adjustment	50-460 (mm)	50-460 (mm)
	PCB size	500 x 460 (mm)	500 x 460 (mm)
	Conveyor height	900±20(mm)
The soldering system	Solder pot	electromagnetic pump tin solder pot
	The amount of tin dross	0.5KG/pot/week x1
	Nitrogen consumption	1.5-2m³/h/potx1
	solder pot numbers	single pot/dual pots/dual pots individual control

FLUX SPRAY MODULE

Introduction:
The spray head which is imported from Germany offers an absolutely precise and well defined flux deposition on even the smallest areas. The flux is targeted to beapplied only to the solder joint,whereby the wettable area can be as small as 3mm.with the effect that ionic contamination is minimized and flux consumption is duced.

Features:
Saving 90%flux compared to traditional mode. The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free. Two axis servo motor control, high positioning accuracy. Minimum ionic contamination.

Specifications:
Flux module x axis distance (max.)	510mm
Flux module y axis distance (max.)	450mm
Max. nozzle speed	7m/min
Flux content	2 L
Flux type	RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1
Flux effective level	L0, L1, M0
Nozzle	130 μm, alternative diameter
Spray pressure	0.5~1.0 bar
Spray width	2~8 mm (with spray nozzle 130 μm)
Spray speed	20 mm/s
Positioning speed	400 mm/s
Positioning accuracy	±0.2 mm
Flux system	2-axis With Servo Drive

PREHEATING MODULE

Introduction:
The current selective soldering processes, in particular those for lead-free soldering, multi-layer boards or high mass components, call for increased preheat capacities. Short wave IR heater on the bottom and hot air convective preheating on the top, toensure preheating evenly.

Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).

Top heater power	4KW
Top heater voltage	220V
Bottom heater powerr	4.8KW
Bottom heater voltage	220V
CDA pressure	0.5-0.7MPa

SOLDERING MODULE

Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.

Specifications:
Solder nozzle position	Middle
Solder content	13 Kg
Max. soldering temperature	350 °C
Min. internal diameter of solder nozzle	3 mm, External Diameter 4.5 mm
Max. Solder wave height	5 mm
Soldering speed X,Y-axis	10 mm/s
Positioning speed X,Y-axis	200 mm/s
Positioning speed Z-axis	100 mm/s
Positioning accuracy	±0.15 mm
Max.solder distance(x axis)	510mm
Max.solder distance(y axis)	460mm
Max.distance of z-axis	58mm
Max.pot moving speed	5.8m/min
Control system	3-axis With Servo Drive

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