| Technical parameters |
| Technical parameters | YSL-T9 |
| Basic Parameters | Screen Frame Size(mm) | 650(X)X420(Y)-1000(X)x880(Y) |
| Thickness:20-40mm |
| Min PCB(mm) | 50(X)x50(Y)mm |
| Max PCB(mm) | 610(X)X510(Y)mm |
| Thickness | 0.2mm~6mm(Usejig when pcb less than 0.4mm) |
| Curve | <1%(Diagonal measurement) |
| PCB backside Part Height | 20mm |
| Conveyor height | 900±40mm |
| Support | Magnetic support,Magnetic piece,Vacuum chamber(Option) |
| Clamp | Side clamp (Standard),please read the option table |
| Edge distance | PCB process edge less than2.5mm |
| Conveyor speed | 0~1500mm/sec,increment 1mm |
| Conveyor belt | U type sync belt |
| Stopper method | Air cylinder |
| Stopper position | Set the PCB stopper position according to the size of board |
| Flow direction | L-R,R-L,L-L,R-R depends on customer |
| Print System | Print speed | 5-200mm/s adjustable |
| Print head | Step motor drive scraper lifting |
| Scraper | Steelscraper,rubber scraper(option) |
| Scraper angle | 60° |
| Scraper pressure | 0~20kg |
| View System | Substrate Separation | Three-section Substrate Separation
(speed):0.1-20mm/s(distance):0-20mm |
| Alignment position method | Mark Automatic aligning |
| Camera | Germany BASLER,1/3”CCD,640*480pixel,
pixel size 5.6μmx5.6μm |
| Acquire image method | Upper/under double photo |
| Camera light | Coaxial light,Ring light four kinds light can adjustable |
| View range | 9mm*7mm |
| Mark dimensions | Diameter or Side length 1mm~2mm,allowable offset 10% |
| Mark shape | Cir,Rec, or rhombus etc |
| Mark position | PCB dedicated mark or PCB pad |
| 2D detection | Standard |
| Accuracy | Table adjusting range | X=±3mm,Y=±7mm,0=±1.5° |
| Positional accuracy | ±0.01mm |
| Printing accuracy | ±0.025mm |
| Time | Cycle time | <10s(ex print,cleaning time) |
| Convert line time | <5min |
| Programming time | <10min |
| Control System | Computer configuration | Industrial PC,Windows official system |
| User authorization | Chinese,English |
| Pre and-next machine connection | SMEMA |
| Systemlanguage | User PWand Senior PW set |
| Cleaning System | Cleaningsystem | Dry and Wet(standard),vacuum model(optional) |
| Liquid level detection | Liquid level auto alarm detection |
| Power Parameters | Main power supply | AC 220V±10%50/60HZ Single phase |
| Total power | about 3kw |
| Main air supply | 4.5-6kgf/cm2 |
| Machine weight | about 950Kg |
| Machine dimensions | 1400(L)x1630(W)x1525(H)mm |
| Option | Pneumatic top clamp | For PCB(thickness≤1mm) |
| Top clamp +side clamp | For PCB(thickness≤1mm) |
| Vacuum adsorption and clean | ForPCB(thickness≤1mm) and FPC |
| Auto tinadded | Auto tin added |
| Autoloading and unloading | / |
| Flexible and universal support | For the Double-sided PCB(PCB backside parts Height≤9mm) |
| Automatic positioning of screen frame | Automatic positioning ofscreen frame |
| PCB board thickness automatic adjustment function | Standard |
| Scraper pressure feedback function | Real-time feedback of scraper pressure |
| Air condition | Customer can buy by themselves |
The rest ofsolder paste
on.the stencil monitoring system | The rest of solder paste on the stencil monitoring system |
| SPTcloseloop | SPI close loop |
| UPS power off protection | UPS15min power off protection |
| Industry 4.0 | Bar code trace function,Production analysis, etc |
